Relevant Experience from R&D through Production Ramp
Silicon Process Nodes
- 28nm – 1um CMOS
- 130nm – 0.7um; 18V – 700V Power BCD
- 180nm Capacitive Isolation
- FeRAM (embedded Ferroelectric Memory)
- High k/Metal gate; Recessed Source-Drain; Ultralow k dielectrics; plasma nitride gate
- Metrology Pattern Recognition Structures
- Design Rules & PDK
Wide Bandgap Processes
- GaN 650V
- SiC 900-1200V
Silicon Wafers
- crystal growth; realtime control; SPC
- defect control and product correlation
- purchase specification for variety of silicon nodes
Packaging & Interconnect
- 3um Thick Aluminum, Damascene Copper top level interconnect for Power
- System in Package power QFN
- HotRod wireless QFN (copper post)
- High voltage and Isolation packaging, including LGA, QFN, and SOIC
- Integrated isolated transformer
- Leadframe design and manufacturing specification
Control, Manufacturing and Fab Operation
- Advanced Process Control, including software (ProcessWORKS), for fab and A/T
- Equipment tracking, OEE (TrackWORKS)
- Manufacturing Execution Systems (WORKS)
- Statistical Process Control (SPC)
- Fault Detection and Classification, including sensor signal trace analysis
- 300mm fab design and build (the process representative for RFAB)
- Equipment specification, bid, order, install, and production release
- Fab and line start-up
Metrology
- Scatterometry, XPS, ellipsometry for ultrathin gate dielectrics
- Wafer, in-line, WAT, Final Test for high voltage, isolation, leading edge CMOS
- Die ID and Leadframe Strip ID
- In-situ sensors like RF, optical, mass spectrometry, temperature
Materials and precursors
- Purchase specifications
- Batch acceptance criteria
- Joint development programs
Joint Development Programs, Consortia, and Universities
- Process and Metrology Equipment projects
- Consortia advisory board leadership (SEMATECH, IMEC, SRC, PowerAmerica)
- University Project definition and management
- University project portfolio management
Standards
- past Chair and co-founder of JEDEC’s JC-70 Committee for Wide Bandgap Power Electronic Conversion Semiconductors
- current founder and Co-convenor of IEC’s new TC47/WG8: Wide bandgap technologies
- Internal company co-coordinator for standards involvement
Business Processes developed and institutionalized
- Automotive product development and release process
- Research and early development business processes
- Analog New Product Development Execution business process and steering team
- Advanced Control business process for development and release to manufacturing
- Equipment development/joint equipment development business process
- Transition of R&D from 200mm into an existing production 300mm (Team300)
- Capital business process for R&D equipment
- Node and major R&D project approval, including financials, timelines, headcount
New Product Development and release
- Control and MES Systems
- Metrology and Sensors
- High Voltage, Isolation, GaN, Power SiP, DCDC products